Photonics, chip packaging to catalyse Inari's growth
Source: The Star
Published on: 2026-10-25 23:38
PETALING JAYA: Inari Amertron Bhd is looking to strengthen its growth prospects by expanding its photonics and advanced semiconductor packaging capabilities, positioning the group to tap rising demand for artificial intelligence (AI) infrastructure and data-centre (DC) connectivity. Chairman Datuk Phang Ah Tong said in the group's financial year 2026 (FY26) annual report that photonics represented one of its key areas of long-term opportunity. Inari has been developing laser and photonics manufacturing capabilities for more than a decade. "Our existing competencies extend across wafer certification, chip fabrication, chip-on-carrier assembly optical sub-assembly and related testing processes. "AI workloads expand, DCs require significantly greater bandwidth, lower latency and increasingly efficient interconnect architectures. This is accelerating the shift towards optical connectivity...
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